Stress analysis of polycrystalline thin films and surface regions by X-ray diffraction

Welzel, U.; Ligot, J.; Lamparter, P.; Vermeulen, A.C.; Mittemeijer, E.J.

doi:10.1107/S0021889804029516

Figure 1
Concept of diffraction stress analysis. When a polycrystal is subjected to stress (in this case a uniaxial compression parallel to the surface), the lattice spacing of the hkl lattice planes varies with the orientation of the lattice planes with respect to the loading direction. This direction-dependent lattice strain can be measured by X-ray diffraction. The direction of the strain measurement is the direction of the diffraction vector and is identified by the angles [varphi]

and

, where

is the rotation angle of the specimen about the specimen surface normal and [psi]

is the inclination angle of the specimen surface normal with respect to the diffraction vector.