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Figure 1
(a) Full timeline of the first heating of wafer 0110. The temperature was measured every second. (b) Beginning of heating with higher time resolution. The crack opens at a temperature of 598 K, i.e. for a temperature difference ΔT of 155 K between the two thermocouples. The side crack was generated between 893 and 895 K, with ΔT = 204 K at about 155–160 s.

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