Figure 6
Measured integral breadth as a function of for a Cu thin film on an Si wafer before the application of load (open circles) and in the loaded state (filled circles). The loading was achieved by cooling from room temperature to 153 K, resulting in a biaxially rotationally symmetric stress state MPa. Error bars for the data are of the same order as the size of the symbols. The dashed lines through these data points have been drawn to guide the eye. |