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Figure 1
The Cu(OH2)62+, NH4+ and SO42− ions in (NH4)2[Cu(OH2)6](SO4)2 and its 18O analogue, employing 99% probability thermal ellipsoids.

Journal logoSTRUCTURAL SCIENCE
CRYSTAL ENGINEERING
MATERIALS
ISSN: 2052-5206
Volume 56| Part 3| June 2000| Pages 438-443
doi:10.1107/S0108768100000963
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