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Figure 1
(a), (b) Diffracted images from the uQFN encapsulated chip on displacement of the sample by 0.15° across the rocking curve. Contact pads on entrance surface. 220 reflection. (c) Schematic diagram of integrated circuit package and deduced curvature of the silicon wafer.

Journal logoJOURNAL OF
APPLIED
CRYSTALLOGRAPHY
ISSN: 1600-5767
Volume 50| Part 2| April 2017| Pages 547-554
https://doi.org/10.1107/S1600576717003132
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