Nondestructive X-ray diffraction measurement of warpage in silicon dies embedded in integrated circuit packages

Tanner, B.K.; Danilewsky, A.N.; Vijayaraghavan, R.K.; Cowley, A.; McNally, P.J.

doi:10.1107/S1600576717003132

Journal of Applied Crystallography Journal of Applied
Crystallography

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Figure 10
Displacement of points in a line through the centre of the die as a function of position along the die obtained by integration of tilt measurements. The solid line is a quadratic fit to the data.

JOURNAL OF
APPLIED
CRYSTALLOGRAPHY

ISSN: 1600-5767

Volume 50| Part 2| April 2017| Pages 547-554

https://doi.org/10.1107/S1600576717003132

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