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Figure 6
White beam section topographs of a package containing four stacked Si dies. The three top dies are 5 mm × 5 mm × 50 µm thick, while the bottom die is 8 mm × 8 mm × 200 µm thick. 220 reflection.

Journal logoJOURNAL OF
APPLIED
CRYSTALLOGRAPHY
ISSN: 1600-5767
Volume 50| Part 2| April 2017| Pages 547-554
https://doi.org/10.1107/S1600576717003132
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