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Figure 3
The TEM images of the cross section of the multilayer with seven C guiding layers and eight Ni cladding layers in the WGA structure, bonded to an Si cap wafer. Scale bar 50 nm. |
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Figure 3
The TEM images of the cross section of the multilayer with seven C guiding layers and eight Ni cladding layers in the WGA structure, bonded to an Si cap wafer. Scale bar 50 nm. |