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Figure 6
The depth-dependent profiles of stresses (a), a0 (b) and c0/a0 (c) for mechanically polished (bi-directional polishing) and ground (where σ11 is parallel to the grinding direction) Ti grade 2 samples, as well as the reference powder sample, obtained by the MGIXD method. Cu Kα radiation and the pseudo-Voigt profile were used for fitting.

Journal logoJOURNAL OF
APPLIED
CRYSTALLOGRAPHY
ISSN: 1600-5767
Volume 51| Part 3| June 2018| Pages 732-745
https://doi.org/10.1107/S1600576718004193
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