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Figure 1
(a) An overview of the device fabrication flow, illustrating the sequence of the major steps of spin coating, bonding and releasing. (b) A top view of a device showing its features and layout. (c) A simplified 3D view of the device architecture with a top inlet layer, a middle channel layer and a bottom supporting layer. (d) A device inserted into a 3D-printed frame connected to a magnetic base, and (e) multiple device-inserted frames accommodated in a 3D-printed cassette.

Journal logoJOURNAL OF
APPLIED
CRYSTALLOGRAPHY
ISSN: 1600-5767
Volume 54| Part 4| August 2021| Pages 1034-1046
https://doi.org/10.1107/S1600576721004155
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