Figure 1
(a) Top view of the imaging experiment setup used on beamline ID19. The ID19 pink beam illuminates the sample (bonded wafers) in the diffraction condition, and a high-speed camera connected to an image intensifier records the diffracted image on the scintillator. The motorized tip is used to initiate the fracture mechanically, and this is detected by the IR laser, which in turn is used to trigger the camera. The enlargement at the centre of the sample shows the propagation of the fracture through the layer of pressurized microcracks. (b) Top view (IR confocal microscopy image) of the layer of pressurized microcracks made by implantation-related defects after a few hours of annealing. (c), (d) Three-dimensional representations of the strip and wafer samples, respectively. The red dot represents the IR laser. |