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Figure 1
(a) Schematic of the positions of the transistors in the LM3046 integrated circuit chip as they appear in the diffraction images. (b) Radiograph showing the bond pad locations on the chip as viewed in the diffraction images. Note this is mirrored with respect to the schematics on the manufacturers' data sheets. Chip dimensions 1 × 1 mm.

Journal logoJOURNAL OF
APPLIED
CRYSTALLOGRAPHY
ISSN: 1600-5767
Volume 55| Part 5| October 2022| Pages 1139-1146
https://doi.org/10.1107/S1600576722007142
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