Figure 6
`Exploded' diagram depicting SOS chip loading. (a) The base plate of the chip is placed in a form-fitted recess in a slightly raised plateau on a loading plate. (b) A first film is placed over the base plate. (c) Sample slurry is spread over the film within the window region. (d) A second film is added and then (e) the cover plate. The baseplate and cover plate each contain four magnets, oriented to hold two plates together firmly but not overly tightly. If necessary, major wrinkles can be removed by tugging at the periphery of the films. (f) Eight clamping screws are then inserted and tightened, pulling the cover firmly against the base plate and forcing the two films together against the O-ring as it is compressed to seal the sample inside the films while also stretching out any remaining wrinkles. As with the SOSOS chip, a press can be used to decrease the thickness of the sample layer and increase its uniformity before the screws are fully tightened (see the supporting information). |