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Figure 3
Chip fabrication. (a) PDMS resin was squeezed into a thin layer onto the SU8 master (1). After curing, a foil cover was bonded onto the featured PDMS using a silane coupling chemistry (Tang & Lee, 2010BB42) (2). Then the reinforced PDMS film was peeled off and the chip was lidded using another foil cover (3). (b) Top view and (c) cross section of a device made from COC foil and PDMS. The cross section in (c) was obtained by cutting the chip across the storage array into two and was imaged by placing the chip edge on onto the microscope stage to magnify the cut. The chip shown here had a 5 mm-thick PDMS frame manifold for fluid interfacing where tubing could be directly inserted into the through holes in the PDMS.

IUCrJ
Volume 1| Part 5| August 2014| Pages 349-360
ISSN: 2052-2525
doi:10.1107/S2052252514016960