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Figure 1
Complex fracture of a (001) silicon wafer following rapid thermal annealing (courtesy J. Garagorri, PhD thesis, Universidad de Navarra, San Sebastian, 2014).

IUCrJ
Volume 3| Part 2| March 2016| Pages 86-87
ISSN: 2052-2525
doi:10.1107/S2052252516002359