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Figure 3
Selected images from a series of 3000 showing crack propagation in a silicon wafer under thermal stress (compare crack c1c in Fig. 2[link]). (Left) The direct transmission images. (Right) The diffraction images with the 220 reflection (the diffraction images have been scaled and rotated to match the transmission images).

IUCrJ
Volume 3| Part 2| March 2016| Pages 108-114
ISSN: 2052-2525
doi:10.1107/S205225251502271X