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Figure 2
A fabrication overview of a MISP chip. (a) (1) The design of the MISP chip is translated into a silicon nitride layer on a silicon wafer using laser lithography and RIE. (2) KOH etching forms the inverted pyramidal wells at the surface of the silicon wafer. (3) The remaining silicon nitride is removed using RIE, resulting in the master stamp. (b) (4) Ormostamp is pipetted onto the master and a prepared glass wafer is slowly placed on the top. (5) By applying UV light and heat, the Ormostamp hardens and moulds into the silicon-wafer wells. (6) The working stamp is lifted off resulting in pyramids on the working stamp. (c) (7) The working stamp is used to imprint the cavities into the COC or COP film through hot embossing. (8) The film is demoulded from the working stamp. (9) Frames are glued onto the film resulting in the final product of the polymer fixed targets. Images on the right show the final product of the master stamp, working stamp and fixed targets.

IUCrJ
Volume 10| Part 6| November 2023| Pages 678-693
ISSN: 2052-2525
https://doi.org/10.1107/S2052252523007595