view article
Figure 8
Process flow of an additive-type mask. (a) Deposit layer, (b) define resist, (c) etch layer, (d) strip resist.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 5| Part 3| May 1998| Pages 320-325
https://doi.org/10.1107/S0909049597017615
Follow J. Synchrotron Rad.
Sign up for e-alerts
E-alerts
Follow J. Synchrotron Rad. on Twitter
Twitter
Follow us on facebook
Facebook
Sign up for RSS feeds
RSS