Figure 6
Grain mapping of the top layer in a Cu polycrystal by electron microscopy (EBSP) (top), and using the hard X-ray CS set-up illustrated in Fig. 1 (bottom). Also shown are the determined 〈200〉 pole figures for the individual grains. The boundary of grain P was measured using a (200) reflection from grain P (solid line) as well as (200) reflections from neighbouring grains X, O and Q (dashed lines). |