view article
Figure 2
A press for anodic bonding. The silicon wafer is placed inside the press between the concave and convex forms. The base plate is heated.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 12| Part 4| July 2005| Pages 473-478
https://doi.org/10.1107/S090904950501472X
Follow J. Synchrotron Rad.
Sign up for e-alerts
E-alerts
Follow J. Synchrotron Rad. on Twitter
Twitter
Follow us on facebook
Facebook
Sign up for RSS feeds
RSS