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Figure 2
HIT fabrication diagram. A hybrid imaging technology device combines the best characteristics of CMOS and CCD devices. Multiple conventional `small' high-performance CCD devices are fabricated on a single die. Separately, multiple readout channels are produced using CMOS technology. The two finished devices are bump bonded together (one `flipped' on top of the other) to produce the final hybrid system capable of reading all of the `small' CCD segments in parallel.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 12| Part 5| August 2005| Pages 618-625
doi:10.1107/S0909049505022600
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