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Figure 6
Single module assembly with 8 × 2 chips, mounted on the flex print circuit. The silicon sensor is the vertically oriented plate, viewed from the unstructured aluminized side. The flex print constitutes the Module Control Board (MCB), with the electronic components to operate the 8 × 2 chips. The edges of the eight chips in the upper row can be seen at the edge of the sensor. These are wire-bonded to the curved flexible circuit.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 13| Part 2| March 2006| Pages 120-130
https://doi.org/10.1107/S0909049505038665
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