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Figure 3
Side view of the hybrid CAMAC module. The locations of the major components (functions) are shown. To achieve a dense packing, the linear amplifier sub-board and SCA sub-board are stacked. An on-board CPU (Hitachi H8), dual port memories and a field programmable gate array (FPGA) for controlling the SCA and memories are indicated.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 13| Part 4| July 2006| Pages 314-320
https://doi.org/10.1107/S0909049506015251
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