Figure 7
(a) Three-dimensional tomography of a gold spoke pattern, taken with a resolution of ∼60 nm and an imaged volume of 15 µm × 15 µm × 1 µm. (b) Three-dimensional tomography of an integrated circuit (IC), taken with an imaged volume of 12.5 µm × 7.9 µm × 5.2 µm, clearly showing the hollows at the center of the IC plugs (bright rods). |