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Figure 8
Hardware components of the detector. The insets show the chip mounted on a ceramic carrier. Each chip has two segment structures, only one of which is used at a time (Feser et al., 2006BB8). Left inset: back (n-) of the chip. This is the side where the X-rays will be incident. A wire connection on the upper right carries the bias voltage. Right inset: segmented front (p-) side. Wire bonds connect the detector segments to the carrier pins through a cut-out in the carrier.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 15| Part 4| May 2008| Pages 355-362
doi:10.1107/S0909049508008509
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