view article
Figure 3
(a) The solder stays between the channel walls if MCs are etched (left). In non-etched MCs (right), the solder rises to the walls. (b) Places of strain creation in a MC structure, shown with arrows.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 15| Part 6| October 2008| Pages 543-548
doi:10.1107/S0909049508027374
Follow J. Synchrotron Rad.
Sign up for e-alerts
E-alerts
Follow J. Synchrotron Rad. on Twitter
Twitter
Follow us on facebook
Facebook
Sign up for RSS feeds
RSS