disable zoom     view article     reuse permissions
Figure 3
(a) The solder stays between the channel walls if MCs are etched (left). In non-etched MCs (right), the solder rises to the walls. (b) Places of strain creation in a MC structure, shown with arrows.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 15| Part 6| October 2008| Pages 543-548
https://doi.org/10.1107/S0909049508027374
Follow J. Synchrotron Rad.
Sign up for e-alerts
E-alerts
Follow J. Synchrotron Rad. on Twitter
Twitter
Follow us on facebook
Facebook
Sign up for RSS feeds
RSS
We use cookies on our websites, and by using this site you are consenting to them: allow all or manage