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Figure 4
Typical analyser crystals used at ID16. (a) Diced crystal for high-resolution applications, thickness 2 mm and a cube size 0.7 mm (detail zoomed in); (b) bent crystal for low-resolution applications, anodic bonded to the glass substrate; (c) stress-relief-cut crystal for medium-resolution applications, thickness 250 µm, period 2.5 mm. All crystal wafers have a diameter of 100 mm.

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SYNCHROTRON
RADIATION
ISSN: 1600-5775
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