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Figure 1
(a) Detail of a quarter of the diamond sensor TiW electrodes before wire bonding. The rear face of the detector has a single large-area contact pad, not visible in this image. (b) Diamond wire bonded in its ceramic carrier (3 mm hole under diamond not visible).

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 17| Part 4| May 2010| Pages 456-464
doi:10.1107/S0909049510016547
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