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Figure 2
Photographs of the support PCB and enclosure from different angles and at different levels of construction. (a) The system entirely assembled from the top side. An X-ray-transparent aluminized Mylar window covers a hole in the top brass cover. The three barbed hose-fittings are a vacuum port and connections for cooling water. (b) The enclosure with the brass cover removed to reveal the PGA and chip mounted in the ZIF socket. (c) The chip is removed to show the copper cold-finger that protrudes through the ZIF socket. (d) PCB photographed from the back side so that the control FPGA board is shown on the right. The support PCB measured 8.0 inch × 2.85 inch.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 18| Part 2| March 2011| Pages 157-164
https://doi.org/10.1107/S090904951004104X
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