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Figure 5
Zoom in on a silicon sensor with bumps for Pilatus (left), Eiger (middle) and Mönch (right). The photographs are to scale, i.e. the red squares indicate the pixel size of 172 µm from Pilatus (large), 75 µm from Eiger (medium) and 25 µm from Mönch (small). The 25 µm pixel size is close to the limit for the in-house bump-bonding process at the Paul Scherrer Institut.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 21| Part 5| August 2014| Pages 1006-1010
doi:10.1107/S1600577514017135
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