Figure 7
Schematic of the DXRL process; at first the film is exposed to hard X-rays (a) then the not-exposed regions are removed from the substrate through development (b). (c) Optical microscope image and (d) X-ray fluorescence map obtained from the integration of the Zn signal on a ZnO film after patterning with a 356 J cm−2 X-ray dose and development. |