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Figure 1
Photograph of an initial four-inch silicon wafer containing multiple copies of the PAD's sensor interspersed with test structures. Later wafers were patterned with sensors only, varying characteristics such as implant size inside a pixel and the metallization in preparation for commercial bump-bonding. Sensor fabrication was carried out inside our 8000 square-foot class 100 clean room facility (MRDL at NIU).

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 23| Part 1| January 2016| Pages 196-205
doi:10.1107/S1600577515018044
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