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Figure 1
(a) Components of the full chip: the XBPM device, a sapphire plate, which is in contact with a water-cooled copper plate, and the printed circuit board (PCB). The PCB is placed on top for connections towards the XBPM and the readout system. (b) Simulated temperature profile across the 4H-SiC XBPM with the beam centered at the origin. As can be seen, already at 375 µm, the temperature drops below 100°C.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 26| Part 1| January 2019| Pages 28-35
https://doi.org/10.1107/S1600577518014248
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