Diffraction stress analysis of highly planar-faulted, macroscopically elastically anisotropic thin films and application to tensilely loaded nanocrystalline Ni and Ni(W)

Kurz, S.J.B.; Welzel, U.; Bischoff, E.; Mittemeijer, E.J.

doi:10.1107/S1600576713030756

Journal of Applied Crystallography Journal of Applied
Crystallography

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Figure 11
Stress evolution in the Ni–Kapton film during tensile testing to a maximum elongation of 280 µm. It appears that the film deforms elastically up to a stress value of 990 MPa, before plastic deformation and cracks are initiated, accompanied by a stress decrease.

JOURNAL OF
APPLIED
CRYSTALLOGRAPHY

ISSN: 1600-5767

Volume 47| Part 1| February 2014| Pages 291-302

doi:10.1107/S1600576713030756

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