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Figure 4
(a) Bright-field TEM image of an Ni(W)–wafer film (with a W content of 13 at.%). A small part of the substrate is shown at the bottom. The columnar grains exhibit excessive twinning parallel to the film surface. (b) SADP of the Ni(W)–wafer film, showing rows of discrete spots and rows of spots connected by intensity streaks; the direction of the surface normal has been indicated. (c) Indexing of the SADP, distinguishing affected (red dots on solid line) and unaffected (blue dots on dashed lines) reflections, labelled by adopting hexagonal notation, and a graphical explanation of the geometric relation between tilt angle Ψ and the location of cutting of the (01L)hex streak and thus the 2θ position of the intensity hump in the XRD pattern (cf. Fig. 3[link]d).

Journal logoJOURNAL OF
APPLIED
CRYSTALLOGRAPHY
ISSN: 1600-5767
Volume 47| Part 1| February 2014| Pages 291-302
doi:10.1107/S1600576713030756
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