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Figure 1 The mol­ecular structure of the title compound. Thermal ellipsoids at the 50% probability level. H bond as dashed line.

Journal logoCRYSTALLOGRAPHIC
COMMUNICATIONS
ISSN: 2056-9890
Volume 67| Part 2| January 2011| Page m255
doi:10.1107/S160053681100239X
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