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Figure 1 Thermal ellipsoid plot of the title compound at 50% probability level including hydrogen bonding inter­actions of the complex.

Journal logoCRYSTALLOGRAPHIC
COMMUNICATIONS
ISSN: 2056-9890
Volume 67| Part 5| May 2011| Page o1222
https://doi.org/10.1107/S1600536811012943
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