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Figure 3
Variation in sample parameters during in situ annealing at different temperatures for the h-PS/bis-PCBM sample: (a) temperature, (b) top layer thickness h2, (c) top layer SLD ρ2, (d) top layer roughness σ2, (e) substrate roughness σ0, (f) bottom layer thickness h1, (g) bottom layer SLD ρ1 and (h) bottom layer roughness σ1. The blue curves show the parameters extracted by refnx, the green curves show the raw predicted parameters provided by reflectorch and the results after the polishing step are in red. We have omitted the error bars of the refnx fit where the value approached zero (lower boundary) as those parameter uncertainties are not meaningful. For clarity, we also omitted the uncertainties of the parameters obtained from the polished reflectorch predictions.

Journal logoJOURNAL OF
APPLIED
CRYSTALLOGRAPHY
ISSN: 1600-5767
Volume 59| Part 3| June 2026| Pages 765-773
https://doi.org/10.1107/S1600576726002657
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