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![[Figure 1]](pp5080fig1mag.jpg)
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Figure 1
Photograph of the JUNGFRAU 0.4 chip and sensor on top of which a 150 µm-thick laser-drilled tungsten mask (Laser Zentrum Hannover eV, Hannover, Germany) with ∼28 µm-diameter holes is placed. The chip and sensor are about 3.6 mm × 3.6 mm in size, while the mask dimensions are about 3.3 mm × 3.3 mm. The total active area in the mask region is about 1.1 mm2. The mask is placed on top of the sensor and the mask holes are aligned with the center of the pixels with an automatic sub-micrometer die bonder (Fineplacer Femto, Finetech GmbH & Co. KG, Berlin, Germany). The mask is attached with a drop of glue at each mask corner. The bottom right corner of the mask does not contain any holes for reference purposes. |
![[Figure 1]](pp5080fig1.jpg)
 | JOURNAL OF SYNCHROTRON RADIATION |
ISSN: 1600-5775
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