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Figure 3
Mean of the r.m.s. noise of JUNGFRAU 0.4 (no extra filtering) as a function of the acquisition time for a hybridized assembly (chip bump-bonded to sensor) at chip operating temperatures of 30°C and −10°C and for a bare chip at a chip operating temperature of 30°C. |


journal menu![[Figure 3]](pp5080fig3.jpg)
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