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Figure 5
Recess manufacturing in the diamond anvil and loading. (a) and (b) Secondary electron images of a recess milled in the diamond culet using the Ga-ion gun of the Scios DualBeam at the BGI. The recess is ∼17 µm deep and 100 µm in diameter. (c) Optical image of a diamond with a recess milled by the FIB. One can see that the optical transparency of the diamond is preserved in the recess. (d) Optical image of SiO2 glass compressed in a rhenium gasket at 60 GPa between two milled-miniature diamonds.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 24| Part 1| January 2017| Pages 276-282
https://doi.org/10.1107/S1600577516017112
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