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Figure 1
(a) The samples had lithographically patterned regions of Al/Ni multilayer (4 cm long by 1 cm wide) along with gold pads (0.5 cm by 1 cm) to act as electrical contacts. (b) The samples were dynamically bent in a four-point loading apparatus, with the curvature of the specimen measured by a laser wafer-curvature technique and temperature monitored by an optical pyrometer. (c) Example raw data from a 3 × 1 section of chips on the MMPAD array.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 24| Part 4| July 2017| Pages 796-801
https://doi.org/10.1107/S1600577517008013
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