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Figure 1
Schematic representation of the hot-press-assisted fabrication procedure for the microfluidic device. (a) Overview of the device layers and alignment. (b) Layer stacking inside the hot press for bonding. The metal frame is sandwiched between two Kapton FN foils. The hot plates are protected with two Kapton HN foils to avoid attachment of the device to the hot press. The plates are heated and sealed during bonding.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 26| Part 2| March 2019| Pages 406-412
https://doi.org/10.1107/S1600577519000304
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