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Figure 4
(a) A schematic of the first bonding between Si and TPX wafer using anodic bonding. (b) A schematic of the second bonding between Invar spherical substrate and Si/TPX wafer.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 28| Part 3| May 2021| Pages 756-768
https://doi.org/10.1107/S160057752100179X
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