Figure 7
(a) SEM image of one typical damaged area on the silicon wafer. Its ablation area is marked with a yellow circle. The two white lines show the x and y diameters of the ablation area. (b) 3D-CLSM image of the damaged area shown in (a); the deepest part is about 7 µm from the surface. (c) The X and Y diameters of the 14 ablation areas are measured and displayed as points. The two straight lines are the average values of the X (gray line) and Y (black line) diameters. |