Figure 2
Schematic illustration of the sample preparation. (a) Coated insert, from which an approximately 300 µm-thick slice is cut (b). (c) Focused ion beam (FIB) milling is used to locally reduce the thickness of the slice to produce a lamella with a thickness below 50 µm (50 µm is the width of the indenter wedge). The lamella is placed close to the downstream edge in order to avoid shadowing of the detector and allow the full 111 diffraction ring to be captured. (d) SEM image of the FIB milled trench, viewed from the downstream side. |