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Figure 3
Sensor module formed from CdTe sensor layer bonded to a Keck-PAD ASIC. The sensor layer (A) is bump-bonded to an underlying ASIC (not visible) which is wire-bonded (B) to the printed circuit board (C).

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 31| Part 5| September 2024| Pages 1217-1223
https://doi.org/10.1107/S160057752400643X
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