Characterizing electron-collecting CdTe for use in a 77 ns burst-rate imager

Franklin, L.A.; Brown, N.J.; Gruner, S.M.; Met-Hoxha, E.; Tate, M.W.; Thom-Levy, J.

doi:10.1107/S160057752400643X

Journal of Synchrotron Radiation Journal of
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Figure 3
Sensor module formed from CdTe sensor layer bonded to a Keck-PAD ASIC. The sensor layer (A) is bump-bonded to an underlying ASIC (not visible) which is wire-bonded (B) to the printed circuit board (C).

JOURNAL OF
SYNCHROTRON
RADIATION

ISSN: 1600-5775

Volume 31| Part 5| September 2024|

https://doi.org/10.1107/S160057752400643X

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