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Figure 7
Schematic of the investigated Si wafer with an array of 10 × 10 Berkovich indentations at its center. The indents are referenced A–J (left–right) and 1–10 (top–bottom). The green rectangle indicates the FOV imaged during the in situ XWBT measurements; the blue box marks the ROI characterized ex situ after heating.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 33| Part 4| July 2026|
https://doi.org/10.1107/S1600577526004728
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