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Figure 1
Modelling process for the multilayer thermal analysis model: substrate meshing (left); one shell containing 20 sub-layers with sub-layer thickness of 0.1 mm, generated from the top surface of the substrate meshing and performed by /ESHAPE,1 (middle); multi-shells generated and properly connected by the constraint equations (CE) (right).

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 24| Part 3| May 2017| Pages 717-724
https://doi.org/10.1107/S1600577517004738
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