view article
Figure 9
Flip-chip solder bump defects investigation in a DDR3 memory module by cone beam laminography. Projection image (a); reconstructed absorption slice (b) with a zoomed region showing some of the discovered defects.

Journal logoJOURNAL OF
SYNCHROTRON
RADIATION
ISSN: 1600-5775
Volume 29| Part 3| May 2022| Pages 916-927
https://doi.org/10.1107/S160057752200282X
Follow J. Synchrotron Rad.
Sign up for e-alerts
E-alerts
Follow J. Synchrotron Rad. on Twitter
Twitter
Follow us on facebook
Facebook
Sign up for RSS feeds
RSS